17th INTERNATIONAL FORUM ON MPSoC
for software-defined hardware
For further information, please send email to Frédéric Pétrot
Professor at Ecole Polytechnique de Montréal, Canada
Thermal Modeling and Simulation for 3D ICs
One of the main challenges for the design of effective 3-D ICs is temperature control. Their compact structure can lead to high temperatures, with uneven distributions, effectively reducing the performance and expected lifetime of these devices. This makes conventional air-cooled devices more susceptible to overheating. Alternative solutions to improve dissipation and reduce thermal issues need to be explored To avoid impacting on the design schedule, fast and accurate thermal models is of paramount importance to allow the designer to evaluate multiple alternatives, while the layout and the power output of the device are still subject to change. In this presentation, I will present advanced modelling and analysis solutions for transient thermal behaviour of 3-D ICs.
Gabriela Nicolescu obtained her MSc degree from Politechnica Bucharest and her PhD degree, in 2002, from INPG (Institut National Polytechnique de Grenoble) in France. She has been working at Ecole Polytechnique de Montreal (Canada) since 2003, where she is a professor in the Computer and Software Engineering Department. Dr. Nicolescu's research interests are in the field of programming, modeling and simulation of advanced systems. She published five books and she is the author of more than hundred articles in journals, international conferences and of book chapters.