For further information, please contact the General chair: Pierre-Emmanuel Gaillardon
Nielson Scientific, USA
3D Silicon Nanofabrication of Multi-Functional Interposers for 3D Integration
We are developing a new 3D nanofabrication method for silicon and other semiconductor materials that allows the creation of 3D nanostructures directly from 3D computer models in a single tool. This capability opens up new possibilities for interposers for 3D integration including the ability to create 3D through silicon vias, 3D through silicon photonic vias (i.e., waveguides through the thickness of the wafer), and integrated microfluidic cooling channels all within a single silicon interposer die. These interposer advancements made possible by the 3D nanofabrication method we are developing have the potential to enable many new high-performance 3D IC architectures by addressing many of the shortcomings of existing interposer technologies.
Gregory N. Nielson is the CEO and founder of Nielson Scientific. Previously, Dr. Nielson served as the Chief Scientist for Vivint Solar, the CTO of mPower Technologies, and as a Principal Member of Technical Staff and Truman Fellow at Sandia National Laboratories. He received MS and PhD degrees from MIT and a BS degree from Utah State University. He has worked in optical microsystems and optoelectronics using a variety of semiconductor materials for 20 years. He is an author on over 80 technical publications and is an inventor on more than 50 patents/patent applications. He is a member of IEEE, OSA, and ASME.